Definition
An optical patterned-wafer inspector illuminates and scans production wafers, compares detected signals across dies or to a reference, and applies detection and classification algorithms to identify candidate defects at useful production throughput.
Process position
Inputs
- Processed wafer
- Inspection recipe
- Die or design reference
- Defect thresholds
Outputs
- Defect map
- Candidate images or signatures
- Excursion indicators
How it works
- 01Load and align wafer
- 02Select optical and detection mode
- 03Scan production area
- 04Detect and classify candidates
- 05Sample review and disposition
Role in the production flow
Optical inspection trades ultimate resolution for broad, fast coverage. It is normally paired with slower review and analysis tools so that production monitoring can detect excursions without treating every signal as a confirmed physical defect.
A high-throughput optical system that detects and maps defects on patterned wafers for process monitoring and yield learning.
Boundary: The cited manufacturers document the equipment category and its intended uses; this record does not independently validate vendor performance claims or rank products.
Qualification and production boundaries
The inspection strategy must state target defect classes, minimum actionable size, optical mode, layer noise, capture and nuisance targets, wafer sampling, review capacity, recipe ownership, and escalation limits.
The inspection strategy must state target defect classes, minimum actionable size, optical mode, layer noise, capture and nuisance targets, wafer sampling, review capacity, recipe ownership, and escalation limits.
Boundary: Actual acceptance limits, recipes, throughput, availability, and ownership economics are product-, process-, site-, and contract-specific.
Sources
Citations support the tagged claims above. Access dates record when Maha Strategies last checked the public source.
- [1]Annual Report: Process Control and Yield Management · KLA · 2024 · accessed 2026-08-13
- [2]Annual Report: Inspection, Metrology, and Yield Analysis · KLA · 2019 · accessed 2026-08-13