DISCO
Precision wafer and package processing equipment
Supplies grinding, polishing, dicing, and related precision-processing equipment and consumables.
What public evidence supports
DISCO technical material describes wafer backgrinding, stress relief, blade and laser singulation, and die-strength considerations.
Evidence boundary
Equipment capability must be qualified against the wafer stack, street, thickness, die-strength target, and contamination controls.
Linked process capabilities
The links below show where the documented capability fits in the chip lifecycle. They are not customer or qualification claims.
Process
Silicon wafer preparation
How electronic-grade silicon becomes a flat, polished, oriented, and qualified substrate for device fabrication.
Process
Thinning & dicing
How finished wafers are protected, back-ground, stress-relieved, singulated, inspected, picked, and transferred without damaging thin die.
Sources
- [1]Semiconductor and Wafer Manufacturing Process · DISCO · accessed 2026-08-13
- [2]Silicon Wafer Thinning, the Singulation Process, and Die Strength · DISCO · 2016 · accessed 2026-08-13