Dow
Electronic materials and process chemicals
Supplies electronic-grade glycol ethers and other materials used in semiconductor and packaging formulations.
What public evidence supports
Dow publicly markets an electronic-grade propylene-glycol ether for photoresist, thinner, and edge-bead-removal applications.
Evidence boundary
A marketed electronic grade is not evidence of approval at a named fab or interchangeability with another formulation.
Linked process capabilities
The links below show where the documented capability fits in the chip lifecycle. They are not customer or qualification claims.
Process
Photolithography
How coating, alignment, exposure, baking, development, masks, optics, and process control create patterned resist for semiconductor fabrication.
Process
Copper interconnects & CMP
How dielectric patterning, barriers, seed layers, copper fill, chemical-mechanical planarization, and cleaning form multilayer chip wiring.
Process
Underfill & encapsulation
How polymeric materials fill interconnect gaps, redistribute stress, protect die and wires, and become a permanent part of package reliability.
Applied in Intelligence
Briefs using this capability context
These links identify where the supplier’s public capability profile supports an analytical brief. They do not imply endorsement, customer status, or process-of-record qualification.
Intelligence brief
Ultra-Thin Shock-Absorbing Adhesives: Sub-100μm Market Dynamics
An architectural market assessment of sub-100μm shock-absorbing adhesive layers for premium smartphones, detailing how thin-film chemistry enables 5G antennas and larger batteries.
Intelligence brief
PPG Derivatives in Semiconductor Manufacturing: Process, Purity, and Qualification
A process-by-process framework for assessing polypropylene glycol (PPG), EO/PO block copolymers, glycol ethers, and reactive polyether derivatives in semiconductor manufacturing and advanced packaging.
Sources
- [1]DOWANOL ELECPURE PM 1 Glycol Ether · Dow · accessed 2026-08-13